The use of fast infrared light bursts to process semiconductor chips allows for 3D processing.

A fast burst of Infrared Light opens the way to 3D Processing inside semiconductor chips

Researchers at the LP3 Laboratory, France have developed a technique that uses light to process material locally anywhere on the three-dimensional surface of semiconductor chips. Direct laser writing opens up the opportunity to use the subsurface space in order to increase integration density and add extra functions.

Semiconductors are the core material for electronic devices like cellphones, cars and robots. The current semiconductor manufacturing technology is under increasing pressure due to the constant need for powerful and miniaturized chips.

Due to its surface-processing nature, the dominant manufacturing technology lithography has significant limitations in addressing these challenges. In order to fully utilize the space within the materials, it would be desirable to find a way of fabricating structures beneath the wafer surface.