Scientists at MIT create a low thermal budget growth on an 8-inch scale to enable more powerful and dense computer chips

MIT scientists invent more powerful and dense computer chips

The new ability to grow this material at a low thermal budget on an 8-inch size allows it to be integrated with silicon CMOS and pave the way for future electronic applications.

As our homes and pockets fill with electronic gadgets, and AI and Big Data drive the growth of data centers there is an increasing need for computer chips that are more powerful, potent and dense than ever.

Traditionally, these chips are made from 3D materials that are bulky and boxy. This makes it difficult to stack them into layers.